Santa Clara, CA, USA. March 19, 2026 – ROHM Semiconductor U.S.A., LLC is pleased to announce its participation at APEC 2026, the premier event for the power electronics community. This year’s conference will be held at the Henry B. Gonzalez Convention Center in San Antonio, TX, from March 22–26.

At Booth 1443, attendees can explore ROHM’s latest technologies designed to enhance efficiency, performance, and reliability across a wide range of applications. Interactive product demos will highlight ROHM’s latest breakthroughs and collaboration examples in Silicon Carbide (SiC) and Gallium Nitride (GaN) – technologies driving the evolution of automotive and EV, industrial power, and consumer electronics.
ROHM’s technical team will be on hand to offer detailed insights, answer questions, and discuss how these solutions address today’s most demanding power challenges.

"ROHM is excited to be exhibiting at APEC 2026. This event provides an excellent opportunity to showcase our innovative power solutions, connect with industry professionals, and strengthen relationships with our customers and partners," said Jay Barrus, President of ROHM Semiconductor U.S.A., LLC. "We look forward to meaningful conversations and new opportunities ahead, and we invite you to visit us at booth 1443."

For more information, visit our event page: https://pages.rohm.com/apec-2026.html or stop by our booth at the conference.

To support the rapid expansion of AI infrastructure, ROHM will present SiC power solutions for AI server power supplies. The booth will feature EcoSiC™ modules in compact HSDIP20 and DOT-247 packages, and engineers will explain how
they address key design challenges including improved efficiency, thermal management, and practical implementation.
ROHM will conduct a joint exhibition with TAMURA Corporation at APEC 2026, featuring TAMURA’s gate driver module compatible with ROHM’s SiC modules. This module is suitable not only for server UPSs but also for PV inverters and ESS (Energy Storage Systems).
ROHM will also showcase EcoGaN™ 650V GaN HEMTs in the TOLL package, which have been integrated into AI server power supply units from Murata Power Solutions. In addition, ROHM will present a new GaN-based design-in example.

ROHM will showcase its latest EcoSiC™ power module lineup designed to advance efficiency, power density, and reliability in electrified powertrains. Highlights include the TRCDRIVE pack™ targeted for traction inverters, as well as HSDIP20 and DOT-247 packages ideal for e-pumps and on-board chargers (OBCs). At the booth, ROHM engineers will be available to discuss evaluation methods and system-level design considerations for automotive power stages.

At the booth, attendees can experience an interactive 3-phase brushless motor driver water pump demonstration. This demo features a sensor-less BLDC motor driver for automotive pumps and data-center liquid cooling, offering low BOM cost, high reliability, and flexible control. A 12V/100W pump circulates heated water through a radiator, with a laptop GUI displaying PWM, RPM, flow, and temperature.
ROHM will also highlight its LogiCoA™ power supply solutions, the industry’s first analog–digital fusion control power supply for industrial and consumer equipment. By combining a low-bit MCU-based digital control section with an analog power circuit using silicon MOSFETs, LogiCoA™ delivers full-digital-equivalent functionality with low power consumption and low cost. Demonstrations will include the REF67004-based LogiCoA003-EVK-001 and an LLC converter.