EMD9
NPN+PNP, SOT-563, Dual Digital Transistor (Bias Resistor Built-in Transistor)

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | EMD9T2R
Status | Recommended
Package | EMT6
Unit Quantity | 8000
Minimum Package Quantity | 8000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-563

Package Size [mm]

1.6x1.6 (t=0.55)

JEITA Package

SC-107C

Number of terminal

6

Polarity

NPN+PNP

Supply voltage VCC 1[V]

50.0

Collector current Io (Ic) [A]

0.1

Input resistance R1 1 [kΩ]

10.0

Emitter base Resistance R2 1 [kΩ]

47.0

Supply voltage VCC 2[V]

-50.0

Collector current IC 2[A]

-0.1

Input resistance R1 2 [kΩ]

10.0

Emitter base Resistance R2 2 [kΩ]

47.0

Power Dissipation (PD)[W]

0.15

Mounting Style

Surface mount

Equivalent (Single Part)

DTA114Y / DTC114Y

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Ultra-compact complex digital transistor
· Built-In Biasing Resistors
· Leak absorption type
· Small Surface Mount Package
· Pb Free/RoHS Compliant
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • EMD9 SPICE Model
  • EMD9 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • EMT6 STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations