DTC923TUB
NPN, SOT-323FL, R1 Alone Type Digital Transistor (Bias Resistor Built-in Transistor)

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

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Product Detail

 
Part Number | DTC923TUBTL
Status | Active
Package | UMT3F
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-323FL

Package Size [mm]

2x2.1 (t=1.05)

JEITA Package

SC-85

Number of terminal

3

Polarity

NPN

Supply voltage VCC 1[V]

20.0

Collector current Io (Ic) [A]

0.4

Input resistance R1 1 [kΩ]

2.2

Collector-Emitter voltage VCEO1[V]

20.0

Collector current Io(Ic) [A]

0.4

Power Dissipation (PD)[W]

0.2

Mounting Style

Surface mount

GI hFE

820 to 2700

Output Current [A]

0.4

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Standard digital transistor
· Built-In Biasing Resistors
· Small Surface Mount Package
· Pb Free/RoHS Compliant
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • DTC923TUB SPICE Model
  • DTC923TUB Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • UMT3F STEP Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations