Models
- DTC013ZUB SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMT3F STEP Data
Characteristics Data
- ESD Data
DTC013ZUB
DTC013ZUB
NPN, SOT-323FL, R1≠R2 Leak Absorption Type Digital Transistor (Bias Resistor Built-in Transistor)
NPN 100mA 50V Digital Transistors(Bias Resistor Built-in Transistors)
New alternative products may be available.
Data Sheet
Buy
*
Sample
*
* This is a standard-grade product.
For Automotive usage, please contact Sales.
For Automotive usage, please contact Sales.
Product Detail
Specifications:
Grade
Standard
Package Code
SOT-323FL
Package Size [mm]
2.0x2.1 (t=0.9)
JEITA Package
SC-85
Number of terminal
3
Polarity
NPN
Supply voltage VCC 1[V]
50.0
Collector current Io (Ic) [A]
0.1
Input resistance R1 1 [kΩ]
1.0
Emitter base Resistance R2 1 [kΩ]
10.0
Power Dissipation (PD)[W]
0.2
Mounting Style
Surface mount
Output Current [A]
0.1
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Features:
1) Built-In bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see inner circuit).2) The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing off the input. They also have the advabtages if completely eliminating parasitic effects.
3) Only the on/off conditions need to be set for operation, making the circuit design easy.
4) Complementary PNP Type: DTA013Z series.
6) Lead Free/RoHS Compliant.
Design Resources
Technical Articles
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- DTC013ZUB SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMT3F STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations