DTA023EUB
PNP, SOT-323FL, R1=R2 Potential Divider Type Digital Transistor (Bias Resistor Built-in Transistor)

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

New alternative products may be available.
Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | DTA023EUBTL
Status | Active
Package | UMT3F
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-323FL

JEITA Package

SC-85

Package Size[mm]

2.0x2.1 (t=0.9)

Number of terminal

3

Polarity

PNP

Supply voltage VCC 1[V]

-50.0

Collector current Io (Ic) [A]

-0.1

Input resistance R1 1 [kΩ]

2.2

Emitter base Resistance R2 1 [kΩ]

2.2

Power Dissipation (PD)[W]

0.2

Mounting Style

Surface mount

GI hFE

20 to

Output Current [A]

0.1

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Standard digital transistor
· Built-In Biasing Resistors
· Small Surface Mount Package
· Pb Free/RoHS Compliant
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • DTA023EUB SPICE Model
  • DTA023EUB Thermal Model (lib)

2D/3D/CAD

  • UMT3F STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations