DTC124XU3HZG
NPN, SOT-323, R1≠R2 Leak Absorption Type Digital Transistor (Bias Resistor Built-in Transistor) for automotive

DTC124XU3 is an digital transistor (Resistor built-in type transistor). Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors. This is a high-reliability product of automotive grade qualified to AEC-Q101.

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Product Detail

 
Part Number | DTC124XU3HZGT106
Status | Recommended
Package | UMT3
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-323

JEITA Package

SC-70

Package Size[mm]

2.0x2.1(t=0.9)

Number of terminal

3

Polarity

NPN

Supply voltage VCC 1[V]

50.0

Collector current Io (Ic) [A]

0.1

Input resistance R1 1[kΩ]

22.0

Emitter base Resistance R2 1[kΩ]

47.0

Power Dissipation (PD)[W]

0.2

Mounting Style

Surface mount

GI hFE

68 or more

Output Current [A]

0.05

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Built-In Biasing Resistors, R1 = 22kΩ, R2 = 47kΩ
  • Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors.
  • Only the on/off conditions need to be set for operation, making the circuit design easy.
  • Complementary PNP Types: DTA124XU3HZG
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • UMT3 STEP Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

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