QSX8
NPN+NPN, SOT-457T, Driver Transistor

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Documents  
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | QSX8TR
Status | Recommended
Package | TSMT6
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-457T

JEITA Package

SC-95

Package Size[mm]

2.9x2.8 (t=1.0)

Number of terminal

6

Polarity

NPN+NPN

Collector-Emitter voltage VCEO1[V]

30.0

Collector current Io(Ic) [A]

1.0

Collector-Emitter voltage VCEO2[V]

30.0

Collector current(continuous) IC2[A]

1.0

hFE

270 to 680

hFE (Min.)

270

hFE (Max.)

680

Mounting Style

Surface mount

Equivalent (Single Part)

2SD2675 / 2SD2675

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Compact complex bipolar power transistor
· For driver
· Small Surface Mount Package
· Pb Free/RoHS Compliant
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Documents

Application Note

  • How to Create Symbols for PSpice Models

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • QSX8 SPICE Model
  • QSX8 Thermal Model (lib)

Characteristics Data

  • QSX8 ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • TSMT6_TR Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations