IMZ1A
NPN+PNP, SOT-457, General Purpose Amplification Transistor

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

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Product Detail

 
Part Number | IMZ1AT108
Status | Active
Package | SMT6
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

SOT-457

Package Size [mm]

2.9x2.8 (t=1.1)

JEITA Package

SC-74

Number of terminal

6

Polarity

NPN+PNP

Collector-Emitter voltage VCEO1[V]

50.0

Collector current Io(Ic) [A]

0.15

Collector-Emitter voltage VCEO2[V]

-50.0

Collector current(continuous) IC2[A]

-0.15

hFE

120 to

hFE (Min.)

120

Mounting Style

Surface mount

Equivalent (Single Part)

2SA1037AK / 2SC2412K

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

· Ultra-compact complex bipolar transistor
· For pre-amplifier
· Small Surface Mount Package
· Pb Free/RoHS Compliant
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • IMZ1A SPICE Model
  • IMZ1A Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • SMT6 3D STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations