Models
- 2SA1576A SPICE Model
- 2SA1576A Thermal Model (lib)
2D/3D/CAD
- UMT3 STEP Data
Characteristics Data
- ESD Data
2SA1576A
Not Recommended for New Designs
2SA1576A
PNP General Purpose Amplification Transistor
This product cannot be used for new designs (Not recommended for design diversion).
Product Detail
Replacement Product For 2SA1576A
| Part Number |
|
|
|---|---|---|
| Ordering Part Number | 2SA1576AT106 | 2SA1576U3T106 |
| Similar Level | - | Same Pinout, Package |
| Data Sheet | ||
| Supply Status | Not Recommended for New Designs | Recommended |
| Package | UMT3 | UMT3 |
| Unit Quantity | 3000 | 3000 |
| Minimum Packing Quantity | 3000 | 3000 |
| Packing Type | Taping | Taping |
| RoHS | Yes | Yes |
| Package Code | SOT-323 | SOT-323 |
| Grade | Standard | Standard |
| Number of terminal | 3 | 3 |
| Polarity | PNP | PNP |
| Collector Power dissipation PC [W] | 0.2 | 0.2 |
| Collector-Emitter voltage VCEO1 [V] | -50.0 | -50.0 |
| Collector current Ic [A] | -0.15 | -0.15 |
| hFE | 120 to 390 | 120 to 560 |
| Mounting Style | Surface mount | Surface mount |
| Package Size [mm] | 2.0x2.1(t=0.9) | 2.0x2.1(t=0.9) |
| JEITA Package | SC-70 | SC-70 |
| Storage Temperature (Min.)[°C] | -55 | -55 |
| Storage Temperature (Min.)[°C] | 150 | 150 |
Design Resources
Technical Articles
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Transistor)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- 2SA1576A SPICE Model
- 2SA1576A Thermal Model (lib)
2D/3D/CAD
- UMT3 STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List - Please contact us by filling in the form.
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations