SCS312AJ
650V, 12A, SMD, High Surge Resistance, Silicon-carbide (SiC) SBD

Low forward voltage, negligible recovery time/current. Suitable for switch mode power supply, uninterruptible power supply, solar inverter, etc.

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Product Detail

 
Part Number | SCS312AJTLL
Status | Recommended
Package | TO-263AB (LPTL)
Unit Quantity | 1000
Minimum Package Quantity | 1000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Reverse Voltage[V]

650

Continuous Forward Current[A]

12.0

Total Power Dissipation[W]

88

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

Package Size [mm]

10.1x9 (t=4.7)

Features:

  • Low forward voltage
  • Negligible recovery time/current
  • Temperature independent switching behavior
  • High surge current capability
  • Low leakage current
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Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

Technical Articles

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (SiC Power Device)
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • SCS312AJ SPICE Simulation Evaluation Circuit
  • SCS312AJ SPICE Model
  • SCS312AJ Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Packaging & Quality

Package Information

  • Package Dimensions
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)