SCS306AP
Not Recommended for New Designs
SCS306AP
Silicon carbide Schottky Barrier Diode
This product cannot be used for new designs (Not recommended for design diversion).
Product Detail
Replacement Product For SCS306AP
| Part Number |
|
|
|---|---|---|
| Ordering Part Number | SCS306APC9 | SCS306AHGC9 |
| Similar Level | - | Same Pinout, Package |
| Data Sheet | ||
| Supply Status | Not Recommended for New Designs | Recommended |
| Package | TO-220ACP | TO-220ACP |
| Unit Quantity | 1000 | 1000 |
| Minimum Packing Quantity | 50 | 50 |
| Packing Type | Tube | Tube |
| RoHS | Yes | Yes |
| Package Size [mm] | 10.2x15.6 (t=4.7) | 10.2x15.6 (t=4.7) |
| Reverse Voltage[V] | 650 | 650 |
| Continuous Forward Current[A] | 6.0 | 6.0 |
| Total Power Dissipation[W] | 46 | 46 |
| Junction Temperature (Max.) [°C] | 175 | 175 |
| Storage Temperature (Min.)[°C] | -55 | -55 |
| Storage Temperature (Max.)[°C] | 175 | 175 |
Design Resources
Documents
Technical Articles
Schematic Design & Verification
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (SiC Power Device)
- How to Use Thermal Models
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- SCS306AP SPICE Simulation Evaluation Circuit
- SCS306AP SPICE Model
- SCS306AP Thermal Model (lib)
- How to Create Symbols for PSpice Models