Not Recommended for New Designs SCS306AP
Silicon carbide Schottky Barrier Diode

This product cannot be used for new designs (Not recommended for design diversion).

Data Sheet
Data Sheet
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Product Detail

 

Replacement Product For SCS306AP

Part Number
SCS306AP
SCS306AP
SCS306AH
SCS306AH
Ordering Part Number SCS306APC9 SCS306AHGC9
Similar Level - Same Pinout, Package
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package TO-220ACP TO-220ACP
Unit Quantity 1000 1000
Minimum Packing Quantity 50 50
Packing Type Tube Tube
RoHS Yes Yes
Package Size [mm] 10.2x15.6 (t=4.7) 10.2x15.6 (t=4.7)
Reverse Voltage[V] 650 650
Continuous Forward Current[A] 6.0 6.0
Total Power Dissipation[W] 46 46
Junction Temperature (Max.) [°C] 175 175
Storage Temperature (Min.)[°C] -55 -55
Storage Temperature (Max.)[°C] 175 175
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Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

Technical Articles

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (SiC Power Device)
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • SCS306AP SPICE Simulation Evaluation Circuit
  • SCS306AP SPICE Model
  • SCS306AP Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)