SCS306AJ

650V, 6A, SMD, High Surge Resistance, Silicon-carbide (SiC) SBD

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SCS306AJ

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SCS306AJ
650V, 6A, SMD, High Surge Resistance, Silicon-carbide (SiC) SBD

Low forward voltage, negligible recovery time/current. Suitable for switch mode power supply, uninterruptible power supply, solar inverter, etc.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

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Product Detail

Part Number | SCS306AJTLL

Status | Recommended

Package | LPTL

Packing Type | Taping

Unit Quantity | 1000

Minimum Package Quantity | 1000

RoHS | Yes

Specifications:

Grade

Standard

Reverse Voltage[V]

650

Continuous Forward Current[A]

Generation

3rd Gen

Total Power Dissipation[W]

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

Package Size [mm]

15.1x10.1 (t=4.7)

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Features:

Low forward voltage
Negligible recovery time/current
Temperature independent switching behavior
High surge current capability
Low leakage current

Design Resources

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Documents

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Type	Title	Last Updated
Data Sheet	SCS306AJ Data Sheet	2022/12/20
Application Note	How to Suppress the Parallel Drive Oscillation in SiC Modules	2024/08/27
Application Note	Part Explanation	2024/08/02

Title	Description
No data available in table

Technical Articles

Search:

Type	Title	Last Updated
Technical Article	Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)	2025/04/16
Schematic Design & Verification	How to Use LTspice® Models	2025/03/06
White Paper	Power Eco Family: Overview of ROHM's Power Semiconductor Lineup	2025/02/26
Technical Article	How to measure the oscillation occurs between parallel-connected devices	2025/01/15
Technical Article	Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules	2024/10/01
Schematic Design & Verification	Method for Monitoring Switching Waveform	2024/06/04
Schematic Design & Verification	Oscillation countermeasures for MOSFETs in parallel	2023/12/19
Technical Article	Diode Types and Applications	2023/11/17
Thermal Design	Judgment Criteria of Thermal Evaluation	2023/03/08
Thermal Design	How to Use the Thermal Resistance and Thermal Characteristics Parameters	2023/02/24
Thermal Design	θ_JA and Ψ_JT	2023/02/13
Thermal Design	θ_JC and Ψ_JT	2023/01/20
Schematic Design & Verification	How to Use LTspice® Models: Tips for Improving Convergence	2023/01/11
Thermal Design	Precautions for Thermal Resistance of Insulation Sheet	2022/10/11
Thermal Design	Measurement Method and Usage of Thermal Resistance RthJC	2022/09/15
Thermal Design	Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials	2022/07/28
Thermal Design	PCB Layout Thermal Design Guide	2022/07/12
Thermal Design	Notes for Calculating Power Consumption:Static Operation	2022/07/06
White Paper	Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs	2022/03/11
White Paper	4 Steps for Successful Thermal Designing of Power Devices	2022/03/07
Thermal Design	Basics of Thermal Resistance and Heat Dissipation	2021/08/18
Thermal Design	What Is Thermal Design	2021/06/24
Thermal Design	Method for Calculating Junction Temperature from Transient Thermal Resistance Data	2021/06/14
Schematic Design & Verification	Application Note for SiC Power Devices and Modules	2020/12/15
Schematic Design & Verification	Importance of Probe Calibration When Measuring Power: Deskew	2020/12/07
Thermal Design	Precautions When Measuring the Rear of the Package with a Thermocouple	2020/10/26
Schematic Design & Verification	Impedance Characteristics of Bypass Capacitor	2020/09/16
Schematic Design & Verification	Calculation of Power Dissipation in Switching Circuit	2020/07/31
Thermal Design	Notes for Temperature Measurement Using Forward Voltage of PN Junction	2020/04/20
Thermal Design	Notes for Temperature Measurement Using Thermocouples	2020/04/09
Thermal Design	Two-Resistor Model for Thermal Simulation	2020/04/09
Thermal Design	How to Use Thermal Models	2020/02/18
Thermal Design	What is a Thermal Model? (SiC Power Device)	2019/12/27

Type	Title	Last Updated
No data available in table

Tools

Search:

Type	Title	Last Updated
Models	SCS306AJ SPICE Thermal Model	2025/02/18
Models	SCS306AJ SPICE Model	2025/02/18
Models	SCS306AJ LTspice Model	2023/09/13
Models	How to Create Symbols for PSpice Models	2021/06/02
Models	SCS306AJ SPICE Simulation Evaluation Circuit	2018/05/28

Packaging & Quality

Search:

Type	Title	Last Updated
Environmental Data	Compliance of the RoHS directive	2025/04/08
Environmental Data	Compliance of the ELV directive	2025/04/08
Environmental Data	Certificate of not containing Stockholm Convention Substances (POPs)	2025/04/08
Package Information	Moisture Sensitivity Level	2024/02/06
Export Information	About Export Administration Regulations (EAR)	2024/02/06
Package Information	Condition of Soldering	2022/04/04
Package Information	Package Dimensions	2017/08/17
Package Information	Anti-Whisker formation	2016/09/27
Environmental Data	Compliance of the ELV directive	2016/09/27
Environmental Data	About Flammability of Materials	2016/09/27

SCS306AJ

SCS306AJ
650V, 6A, SMD, High Surge Resistance, Silicon-carbide (SiC) SBD

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