BD2206G
Load Switch ICs for Portable Equipment

The High-side switch for memory card slot is an IC High-side switch with a function of over-current protection used in the power supply line of a memory card slot. In the switch part an N channel MOSFET low ON resistance has been 1 circuit integrated. Moreover, a soft start function, an under voltage lockout function and an over temperature protection function are integrated.

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Product Detail

 
Part Number | BD2206G-TR
Status | Recommended
Package | SSOP5
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Supply Voltage(Min.)[V]

2.7

Supply Voltage(Max.)[V]

3.6

Current consumption(Typ.)[µA]

70.0

ON Resistance [mΩ]

150

Channel Number [ch]

1

Control Input Logic

Active High

Output Current[A]

0.5

Over Current Detect [A]

0.8 to 1.6

Output Turn on Time [ms]

1.2

Thermal Shut Down

Recovery

Flag Output Delay at Over Current [ms]

15.0

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

85

Package Size [mm]

2.9x2.8(t=1.25)

Features:

・Single low on-resistance (Typ.=150mΩ) Nch MOSFET
・Continuous load current
    0.2A (BD2202G), 0.5A (BD2206G), 0.5A (BD6538G)
    0.55A (BD2224G, BD2225G)
    0.75A (BD2226G, BD2227G)
・Soft start function
・Over current protection circuit
・Over temperature protection circuit
・Under voltage lockout
・Power supply voltage range
    BD2202G, BD2206G : 2.7V to 3.6V
    BD6538G, BD2224G, BD2225G, BD2226G, BD2227G : 2.7V to 5.5V
・Operating temperature range
    BD2202G, BD2206G : -25℃ to 85℃
    BD6538G, BD2224G, BD2225G, BD2226G, BD2227G : -40℃ to 85℃
・SSOP5 Package
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SSOP5 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)