BD71850MWV - Documentation (New)

BD71850MWV integrates all power rails required by i.MX 8M Nano processors and system peripherals. In addition to integrate a sequencer compatible with power modes supported by i.MX 8M Nano processors, making it possible to significantly reduce the development time, decrease size, and simplify application design. The power supply circuit of the BD71850MWV, designed specifically for the power supply system of the i.MX 8M Nano processor family, integrates an 6 buck converters, 6 LDOs, and control logic that allows it to supply power not only to the processor, but the required DDR memory as well – all from a single chip. A 1.8V/3.3V power switch for SDXC cards is also built in, along with a 32.768kHz crystal oscillator driver and multiple protection circuits such as output short-circuit, output over-voltage/current, and thermal shutdown. Buck conversion efficiency from 83 to 95% is achieved for 0.7V to 3.3V output, and the wide input voltage range from 2.7V to 5.5V supports a variety of power sources, from batteries to USB, making them ideal for i.MX 8M Nano applications.

* This is a standard-grade product.
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White Paper

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In this paper, as interest in functional safety and ISO 26262 grows and initiatives and responses are needed, we will introduce these concepts from a semiconductor manufacturer’s perspective, including how they affect the automotive sector.

Application Note

BD71850MWV Platform Design Guide
This document provides the guideline for designing PCB including recommendation for the PCB layer stack up, the components placement and the PCB routings.
BD71850MWV 1x22μF Buck Output Capacitor
This document summarizes the BD71850MWV electrical performance while reducing the BUCK output capacitors from 2pcs x 22μF to 1pcs.
BD71850MWV Frequently Asked Questions
This document question-and-answer format for BD71850MWV which is a Power Management IC for NXP i.MX 8M Nano System-on-Chip (SoC) platform.
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs