BD68620EFV
36V Stepper Motor Driver

BD68620EFV is a bipolar low-consumption driver that driven by PWM current. Rated power supply voltage of the device is 36V, and rated output current is 2.0A. PALA-IN driving mode is adopted for input interface. In terms of current decay, the FAST DECAY/SLOW DECAY ratio may be set without any limitation, and all available modes may be controlled in the most appropriate way. In addition, the power supply may be driven by one single system, which simplifies the design.

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Product Detail

 
Part Number | BD68620EFV-E2
Status | Recommended
Package | HTSSOP-B24
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Vcc (Max.)[V]

36.0

Power Supply Voltage (Max.)[V]

28.0

Power Supply Voltage (Min.)[V]

19.0

Iout (Max.)[A]

2.0

Iout Peak (Max.)[A]

2

Output On Resistance (Typ.)[Ω]

0.95

Interface

PARA-IN

Step

to 1 / 4

MIX DECAY Function

-

Single power supply input

Yes

Automotive class

No

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

85

Features:

  • Rated output current (DC) 2.0A
  • Low ON resistance DMOS output
  • PALA-IN drive mode
  • PWM constant current (other oscillation) Built-in spike noise cancel function (external noise filter is unnecessary)
  • Full-, half (two kinds)-, quarter-step functionality
  • Current decay mode switch
    (linearly variable FAST/SLOW DECAY ratio)
  • Power save function
  • Built-in logic input pull-down resistor
  • Thermal shutdown circuit (TSD)
  • Over-current protection circuit (OCP)
  • Under voltage lock out circuit (UVLO)
  • Over voltage lock out circuit (OVLO)
  • Ghost Supply Prevention
    (protects against malfunction when power supply is disconnected)
  • Microminiature, ultra-thin and high
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • HTSSOP-B24 Footprint / Symbol
  • HTSSOP-B24 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)