RS1G300GN
Nch 40V 80A Power MOSFET

Nch 40V 30A Power MOSFET for High-Efficiency DC/DC converter application and Motor Drivers

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Product Detail

 
Part Number | RS1G300GNTB
Status | Recommended
Package | HSOP8 (Single)
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

HSOP8S (5x6)

Package Size [mm]

5.0x6.0 (t=1.0)

Applications

Power Supply

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

40

Drain Current ID[A]

80.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0024

RDS(on)[Ω] VGS=10V(Typ.)

0.0019

RDS(on)[Ω] VGS=Drive (Typ.)

0.0024

Total gate charge Qg[nC]

28.6

Power Dissipation (PD)[W]

35.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Bare Die Part Number

Available: K4724

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on-resistance
  • High power package (HSOP8)
  • Pb-free lead plating ; RoHS compliant
  • Halogen free
  • 100% Rg and UIS tested
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RS1G300GN SPICE Model
  • RS1G300GN Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations