RS1E350BN
Nch 30V 80A Power MOSFET

RS1E350BN is MOSFET for switching application that features Low on-resistance.

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Product Detail

 
Part Number | RS1E350BNTB1
Status | Recommended
Package | HSOP8 (Single)
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

HSOP8S (5x6)

Package Size [mm]

5.0x6.0 (t=1.0)

Applications

Switching, Motor

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

80.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0018

RDS(on)[Ω] VGS=10V(Typ.)

0.0012

RDS(on)[Ω] VGS=Drive (Typ.)

0.0018

Total gate charge Qg[nC]

95.0

Power Dissipation (PD)[W]

35.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Bare Die Part Number

Available: K4007

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on - resistance
  • High Power Package (HSOP8)
  • Pb-free lead plating; RoHS compliant
  • Halogen Free
  • 100% Rg and UIS Tested
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RS1E350BN SPICE Model
  • RS1E350BN Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • RS1E350BN ESD Data

Packaging & Quality

Package Information

  • HSOP8(TB1) Dimension
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations