RD3P050SNFRA
Automotive Nch 100V 5A Power MOSFET

RD3P050SNFRA is a power MOSFET for switching applications. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Data Sheet Buy Sample
Data Sheet Buy Sample
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | RD3P050SNFRATL
Status | Recommended
Package | TO-252
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

TO-252 (DPAK)

JEITA Package

SC-63

Package Size[mm]

6.6x10.0 (t=2.3)

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

100

Drain Current ID[A]

5.0

RDS(on)[Ω] VGS=4V(Typ.)

0.145

RDS(on)[Ω] VGS=4.5V(Typ.)

0.142

RDS(on)[Ω] VGS=10V(Typ.)

0.135

RDS(on)[Ω] VGS=Drive (Typ.)

0.145

Total gate charge Qg[nC]

14.0

Power Dissipation (PD)[W]

15.0

Drive Voltage[V]

4.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on - resistance
  • Fast switching speed
  • Drive circuits can be simple
  • Parallel use is easy
  • Pb-free lead plating ; RoHS compliant
  • AEC-Q101 Qualified
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RD3P050SNFRA SPICE Model
  • How to Create Symbols for PSpice Models

Characteristics Data

  • RD3P050SNFRA ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations