BR25G640FVT-3
SPI BUS EEPROM

BR25G640FVT-3 is a 64kbit Serial EEPROM of SPI BUS Interface.

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Product Detail

 
Part Number | BR25G640FVT-3GE2
Status | Recommended
Package | TSSOP-B8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Series

BR25G-3

Grade

Standard

I/F

SPI BUS

Density [bit]

64k

Bit Format [Word x Bit]

8k x 8

Package

TSSOP-B8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.6

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

8.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

20M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

Features:

· High Speed Clock Action up to 20MHz (Max)
· Wait Function by HOLDB Terminal
· Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
· 1.6V to 5.5V Single Power Source Operation Most Suitable for Battery Use.
· Up to 32 Bytes in Page Write Mode.
· For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
· Self-timed Programming Cycle
· Low Current Consumption
· Address Auto Increment Function at Read Action
· Prevention of Write Mistake
· More than 100 years Data Retention.
· More than 1 Million Write Cycles.
· Bit Format 8K×8
· Initial Delivery Data
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)