BR93G66F-3
4KBit, MicroWire BUS, Low Power Serial EEPROM

BR93G66-3 is serial EEPROM of serial 3-line Interface method.
They are dual organization(by 16bit or 8bit) and it is selected by the input of ORG PIN.

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Product Detail

 
Part Number | BR93G66F-3GTE2
Status | Recommended
Package | SOP8
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Series

BR93G-3

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

4k

Bit Format [Word x Bit]

256 x 16 / 512 x 8

Package

SOP8

Package Size [mm]

5x6.2 (t=1.71)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Selectable the format(16bit or 8bit) by ORG-pin. Cu wire.

Features:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Actions available at high speed 3MHz clock (4.5 V~5.5 V)
・ High speed write available (write time 5ms max.）
・ Same package and pin layout from 1Kbit to 16Kbit
・ 1.7~5.5V single power source action
・ Address auto increment function at read action
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Program cycle auto delete and auto end function
・ Program condition display by READY / BUSY
・ Dual organization : by 16 bit (X16) or 8 bit (X8)
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ Data retention for 40 years
・ Data rewrite up to 1,000,000 times
・ Data at shipment all addresses FFFFh (X16) or FFh (X8)
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Technical Articles

Schematic Design & Verification

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Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BR93G66F-3 IBIS Model

2D/3D/CAD

  • SOP8 Footprint / Symbol
  • SOP8 3D STEP Data

Packaging & Quality

Package Information

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  • Anti-Whisker formation

Manufacturing Data

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  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

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