BR93G56FVM-3A
2KBit, MicroWire BUS, Low Power Serial EEPROM

BR93G56-3A is serial EEPROM of serial 3-line Interface method.
They are 16bit organization and CS PIN is the first PIN in their PIN configuration.

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Product Detail

 
Part Number | BR93G56FVM-3AGTTR
Status | Recommended
Package | MSOP8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Series

BR93G-3A

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

2k

Bit Format [Word x Bit]

128 x 16

Package

MSOP8

Package Size [mm]

2.9x4(t=0.9)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Cu wire bonding.

Features:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Actions available at high speed 3MHz clock (4.5 V~5.5 V)
・ High speed write available (write time 5ms max.）
・ Same package and pin layout from 1Kbit to 16Kbit
・ 1.7~5.5V single power source action
・ Address auto increment function at read action
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Program cycle auto delete and auto end function
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ Data retention for 40 years
・ Data rewrite up to 1,000,000 times
・ Data at shipment all addresses FFFFh
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Design Resources

 

Documents

Application Note

  • Difference between BR93G-3A/3B and BR93LR-W/L-W

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BR93G56FVM-3A IBIS Model

2D/3D/CAD

  • MSOP8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)