BR24T08F-W
8KBit, I²C BUS, Low Power Serial EEPROM

ROHM's high reliability serial EEPROMs command a large market share and are available in a range of capacities, bus interfaces (Microwire, I²C, SPI), operating voltages (1.7V to 5.5V, 1.8V to 5.5V, 2.5V to 5.5V, 3.0V to 3.6V) and package types, making them ideal for battery powered devices. The entire series are both lead-free and RoHS-compliant.

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Product Detail

 
Part Number | BR24T08F-WE2
Status | Active
Package | SOP8
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes

Specifications:

Series

BR24T-W

Grade

Standard

I/F

I2C BUS(2-Wire)

Density [bit]

8k

Bit Format [Word x Bit]

1k x 8

Package

SOP8

Package Size [mm]

5x6.2 (t=1.71)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.6

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

2.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

400k

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Features:

  • Completely conforming to the world standard I²C BUS.All controls available by 2 ports of serial clock (SCL) and serial data (SDA)
  • Other devices than EEPROM can be connected to the same port, saving microcontroller port
  • 1.6V to 5.5v Single Power Source Operation most suitable for battery use
  • 1.6V to 5.5V wide limit of operating voltage, possible FAST MODE 400kHz operation
  • Page Write Mode useful for initial value write at factory shipment
  • Self-timed Programming Cycle
  • Low current Consumption
  • Prevention of Write Mistake
  • Write (Write Protect) Function added
  • Prevention of Write Mistake at Low Voltage
  • More than 1 million write cycles
  • More than 40 years data retention
  • Noise filter built in SCL / SDA terminal
  • Initial delivery state FFh
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Address and Page Configuration of I2C BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BR24T08F-W IBIS Model

2D/3D/CAD

  • SOP8 Footprint / Symbol
  • SOP8 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)