BR24T512FVT-3AM
512KBit, I²C BUS, Low Power Serial EEPROM for Automotive

BR24T512FVT-3AM is a serial EEPROM of I²C BUS Interface Method

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Product Detail

 
Part Number | BR24T512FVT-3AME2
Status | Recommended
Package | TSSOP-B8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Functional Safety:

Category : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
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Specifications:

Series

BR24T-3AM

Grade

Automotive

Common Standard

AEC-Q100 Grade3 (Automotive Grade)

I/F

I2C BUS(2-Wire)

Density [bit]

512k

Bit Format [Word x Bit]

64k x 8

Package

TSSOP-B8

Package Size [mm]

3x6.4 (t=1.2)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

2.0

Standby Current (Max.)[μA]

3.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

1000k

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Features:

  • All controls available by 2 ports of serial clock (SCL) and serial data (SDA)
  • Other devices than EEPROM can be connected to the same port, saving microcontroller port
  • 1.7V to 5.5V single power source operation most suitable for battery use
  • 1.7V to 5.5V wide limit of operating voltage, possible 1MHz operation
  • Page Write Mode useful for initial value write at factory shipment
  • Self-timed Programming Cycle
  • Low Current Consumption
  • Prevention of Write Mistake
    • WP (Write Protect) Function added
    • Prevention of Write Mistake at Low Voltage
  • More than 1 million write cycles
  • More than 40 years data retention
  • Noise filter built in SCL / SDA terminal
  • Initial delivery state FFh
  • AEC-Q100 Grade3 Qualified
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Address and Page Configuration of I2C BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration