RB228NS-30FH
Super Low IR, 30V, 30A, TO-263S (D2PAK), Schottky Barrier Diode for Automotive

RB228NS-30FH is the high reliability Automotive Schottky Barrier Diode, suitable for switching power supply.

Data Sheet Buy
Data Sheet Buy
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | RB228NS-30FHTL
Status | Recommended
Package | TO-263S (D2PAK)
Unit Quantity | 1000
Minimum Package Quantity | 1000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

C-Common

Package Code

TO-263S (D2PAK)

Package(JEITA)

SC-83

Package Size[mm]

13.3x10.1 (t=4.5)

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

35

Reverse Voltage VR[V]

30

Average Rectified Forward Current IO[A]

30.0

IFSM[A]

100.0

Forward Voltage VF(Max.)[V]

0.72

IF @ Forward Voltage [A]

15.0

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current[V]

30

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Cathode common dual type
  • High reliability
  • Super low IR
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RB228NS-30FH SPICE Model
  • RB228NS-30FH Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations