RB520VM-30
30V, 200mA, SOD-323FL, Schottky Barrier Diode

RB520VM-30 is low VF high reliability Schottky Barrier Diode, suitable for general rectification.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | RB520VM-30TE-17
Status | Recommended
Package | UMD2
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Configuration

Single

Package Code

SOD-323FL

Package Size [mm]

1.25x2.5 (t=0.9)

Package(JEITA)

SC-90A

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

30

Reverse Voltage VR[V]

30

Average Rectified Forward Current IO[A]

0.2

IFSM[A]

1.0

Forward Voltage VF(Max.)[V]

0.51

IF @ Forward Voltage [A]

0.1

Reverse Current IR(Max.)[mA]

0.001

VR @ Reverse Current[V]

10

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Small mold type (UMD2)
  • High reliability
  • Low VF
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RB520VM-30 SPICE Model
  • RB520VM-30 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • UMD2 STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations