RBQ30NS45A
Low IR, 45V, 30A, TO-263S (D2PAK), Schottky Barrier Diode

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | RBQ30NS45ATL
Status | Recommended
Package | TO-263S (D2PAK)
Unit Quantity | 1000
Minimum Package Quantity | 1000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Configuration

C-Common

Package Code

TO-263S (D2PAK)

Package Size [mm]

13.3x10.1 (t=4.5)

Package(JEITA)

SC-83

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

45

Reverse Voltage VR[V]

45

Average Rectified Forward Current IO[A]

30.0

IFSM[A]

100.0

Forward Voltage VF(Max.)[V]

0.65

IF @ Forward Voltage [A]

15.0

Reverse Current IR(Max.)[mA]

0.2

VR @ Reverse Current[V]

45

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

・Cathode common type.
・Low IR type, highly reliable.
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RBQ30NS45A SPICE Model
  • RBQ30NS45A Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations