RFN10NS3SFH (Under Development)
Fast Recovery Diode (AEC-Q101 Qualified)

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

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Product Detail

 
Part Number | RFN10NS3SFHTL
Package | TO-263S (D2PAK)
Unit Quantity | 1000
Minimum Package Quantity | 1000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Single

Package Code

TO-263S (D2PAK)

Package Size [mm]

13.3x10.1 (t=4.5)

Package(JEITA)

SC-83

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

350

Reverse Voltage VR[V]

350

Average Rectified Forward Current IO[A]

10.0

IFSM[A]

100.0

Forward Voltage VF(Max.)[V]

1.5

IF @ Forward Voltage [A]

10.0

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current [V]

350

trr(Max.)[ns]

30

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

・Power mold type.
・Ultra-low VF, ultra high-speed switching and low switching loss products.
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RFN10NS3SFH Thermal Model (lib)

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations