BD3861FS
Sound Processors with Built-in 3-band Equalizer

ROHM's sound processors integrate a five-input selector, electronic volume control, a three-band frequency equalizer, microphone input, and surround sound into a single chip and feature a wide dynamic range and a low distortion rate, making them ideally suited for use in portable stereo systems (BOOM BOX) and mini stereo systems.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | BD3861FS-E2
Status | Recommended
Package | SSOP-A32
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Vcc(Min.)[V]

6.5

Vcc(Max.)[V]

9.5

Iq[mA]

13.0

I/F

2-wire

Volume Range

0to-50 -50to-70 / -∞ (2dB / step) (4dB / step)

Tone Control Band

BASS, Middle, Treble

Input Gain[dB]

0to26 (2dB / step)

Rear Volume[dB]

0to-59 / -∞ (1dB / step)

THD[%]

0.02

Output Noise[µVrms]

8

Output voltage(Max.)[Vrms]

2.5

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

75

Package Size [mm]

13.6x7.8(t=2.01)

Features:

・High S/N,achieved by implementing 2-stage configuration of Front Volume and Rear
    Volume.
・Provides surround and rear volume with Soft-switch to reduce a shock sound during
    switching functions(BD3883FS).
・Volume and tone implemented with the resistance ladder circuit.
    (to achieve high performance with low noise and low distortion)
・Uses the BiCOMS process that achieves low-consumption current,which contributes to an
    energy-saving design.
・SSOP-A32 and SSOP-B40 are used for the packages.Input pins and output pins are
    organized and separately laid out to as to keep the signal flows in one direction
    which consequently,simplify pattern layout of the set board and decrease
    the board dimensions.
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SSOP-A32 Footprint / Symbol
  • SSOP-A32 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)