BD3491FS
Sound Processor with Built-in Surround Sound Function

Built in stereo 6 input selectors and volume that there is not an impedance change of a volume terminal. And this is sound processor can realize 2-band equalizer (Bass/Treble, Gain±14dB / 2dB_step) and BassBoost, Output gain, Surround by external components.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | BD3491FS-E2
Status | Recommended
Package | SSOP-A32
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Vcc(Min.)[V]

4.75

Vcc(Max.)[V]

9.5

Iq[mA]

7.0

I/F

I2C BUS

Volume Range

0to-87 / -∞ (1dB / step) Independent control

Tone Control Band

BASS, Treble

Input Gain[dB]

0 / 2 / 4 / 6 / 8 / 12 / 16 / 20

Surround

Yes

THD[%]

0.002

Output Noise[µVrms]

5

Output voltage(Max.)[Vrms]

2.3

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Package Size [mm]

13.6x7.8(t=2.01)

Features:

· Equipped with 6 single ended stereo input selectors.
· Built-in input gain controller suitable for mobile audio.
· Volume input terminal can be used as a microphone input terminal since its impedance remains constant even if volume setting is changed.
· Bi-CMOS process is suitable for the design of low current and low energy. It also provides more quality for Bi-CMOS small scale regulator and heat in a set.
· The package of this IC is SSOP-A32. Sound input terminals and output terminals arrangement is optimized for easy and fast layout of PCB pattern. At the same time, it minimizes PCB area.
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SSOP-A32 Footprint / Symbol
  • SSOP-A32 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)