BD7562FVM
High Speed Input-Output Full Swing Operational Amplifier

ROHM's family of High voltage CMOS op-amps (BD7561, BD7541, BD7562, and BD7542) integrate phase compensation, input / output full swing operation, and 1 or 2 circuits on a single chip. Additional feature wide operating voltage range of between 5.0V and 14.5V (single power supply) , combined with low current consumption and incredibly low input bias current, make them ideal for applications of all types.

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Product Detail

 
Part Number | BD7562FVM-TR
Status | Recommended
Package | MSOP8
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Power supply (Min.) [V] (+5V=5, +/-5V=10)

5.0

Power supply (Max.) [V] (+5V=5, +/-5V=10)

14.5

Channel

2

Circuit Current (Typ.) [mA]

0.9

Input Offset Voltage (Max.) [mV]

9.0

Input Bias Current (Typ.) [nA]

0.001

Slew Rate (Typ.) [V/µS]

0.9

Input Voltage Range [V]

VSS to VDD

Output Voltage Range [V]

VSS+0.1 to VDD-0.1

Voltage gain (Typ.) [dB]

95.0

Output current (Typ.) [mA]

8.0

CMRR (Typ.) [dB]

60.0

PSRR (Typ.) [dB]

80.0

GBW (Typ.) [MHz]

1.0

Operating Temperature (Min.) [°C]

-40

Operating Temperature (Max.) [°C]

85

Package Size [mm]

2.9x4(t=0.9)

Features:

・Wide operating supply voltage(+5[V]～+14.5[V])
・+5[V]～+14.5[V](single supply), ±2.5[V]～±7.25[V](split supply)
・Input and Output full swing
・Internal phase compensation
・High slew rate
・High large signal voltage gain
・Internal ESD protection : Human body model (HBM) ±4000[V](Typ.)
・Wide temperature range
    -40[℃]～+85[℃]
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Low-Side Current Sensing Circuit Design
  • Op-Amp / Comparator Tutorial
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BD7562FVM SPICE Model

2D/3D/CAD

  • MSOP8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)