ROHM participated in the NVIDIA "AI Factory MGX Ecosystem" ceremony at OCP Global Summit 2026, held from October 12 to 15, 2026, in San Jose, California, USA.
With the growing adoption of generative AI and increasing performance demands on AI servers, power consumption in data centers continues to rise, making more efficient power delivery a critical challenge. Against this backdrop, next-generation 800V direct current (800VDC) power architectures are gaining attention for their potential to reduce power losses and enable higher power density in power systems.
As an NVIDIA partner, ROHM is supporting the advancement of 800VDC power architectures for next-generation AI data centers.
By combining a broad portfolio of SiC, GaN, and Si power devices—including SiC MOSFETs and SiC power modules suited for high-voltage, high-power conversion, as well as GaN devices capable of high-speed switching—with analog ICs, ROHM contributes to reducing power conversion losses and enabling more compact, energy-efficient power systems.
ROHM will continue to strengthen its collaboration with NVIDIA and other ecosystem partners, leveraging its expertise in power semiconductors and analog ICs to contribute to the development of next-generation, energy-efficient AI infrastructure.
Related Information
White Paper: ROHM's 800VDC Architecture Solutions for AI Servers

ROHM Participates in NVIDIA MGX Ecosystem Ceremony at OCP Global Summit 2026
ROHM participated in the NVIDIA "AI Factory MGX Ecosystem" ceremony at OCP Global Summit 2026, held from October 12 to 15, 2026, in San Jose, California, USA.
With the growing adoption of generative AI and increasing performance demands on AI servers, power consumption in data centers continues to rise, making more efficient power delivery a critical challenge. Against this backdrop, next-generation 800V direct current (800VDC) power architectures are gaining attention for their potential to reduce power losses and enable higher power density in power systems.
As an NVIDIA partner, ROHM is supporting the advancement of 800VDC power architectures for next-generation AI data centers.
By combining a broad portfolio of SiC, GaN, and Si power devices—including SiC MOSFETs and SiC power modules suited for high-voltage, high-power conversion, as well as GaN devices capable of high-speed switching—with analog ICs, ROHM contributes to reducing power conversion losses and enabling more compact, energy-efficient power systems.
ROHM will continue to strengthen its collaboration with NVIDIA and other ecosystem partners, leveraging its expertise in power semiconductors and analog ICs to contribute to the development of next-generation, energy-efficient AI infrastructure.
Related Information
White Paper: ROHM's 800VDC Architecture Solutions for AI Servers
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