Environmental CertificationsEnvironmental Management
ROHM Group Environmental Certifications
< ISO14001:2015 >
| Locations | Certification | (Initial registration date)/ Renewal date/ Expiry date |
Certificate body Certificate No. |
Scope of Products or Services Covered | |
|---|---|---|---|---|---|
| ROHM Co., Ltd. |  |
('98.5.29)/'24.11.17/'27.11.16 | JQA/JQA-EM0170 | Design / Development, Manufacture, Sales and Distribution of ICs and Other Electronic Components, etc. | |
| ROHM Co., Ltd. Head office | Design / Development, Manufacture and Sales of ICs and Electronic Components, etc. | ||||
| ROHM Co., Ltd. Shiga Factory | Manufacture of Discrete Semiconductors (Wafer Process). | ||||
| ROHM Co., Ltd. Yokohama Technology Center | Design / Development and Sales of ICs. | ||||
| ROHM Assembly Manufacturing Co., Ltd. Kasaoka Plant ROHM Device Manufacturing Co., Ltd. Kasaoka Plant (formerly ROHM Wako Co., Ltd.) |
Manufacture of ICs, Diodes, LEDs and Laser Diodes. | ||||
| ROHM Assembly Manufacturing Co., Ltd. Logistec Center (formerly ROHM Wako Co., Ltd. Logistec Center) |
Distribution of ROHM Group Products. | ||||
| ROHM Assembly Manufacturing Co., Ltd. Hirokawa Plant (formerly ROHM Apollo Co., Ltd. Head office) |
Manufacture of Transistors, Diodes, Tantalum Capacitors, Resistor and Module. | ||||
| ROHM Assembly Manufacturing Co., Ltd. Yukuhashi Plant (formerly ROHM Apollo Co., Ltd. Yukuhashi Factory) |
Manufacture of ICs. | ||||
| ROHM Device Manufacturing Co., Ltd. Hamamatsu Plant (formerly ROHM Hamamatsu Co., Ltd.) |
Manufacture of ICs and LEDs (Wafer Process). | ||||
| ROHM Device Manufacturing Co., Ltd. Chikugo Plant (formerly ROHM Apollo Co., Ltd. Chikugo Factory) |
Manufacture of ICs and Discretes (Wafer Process). | ||||
| ROHM Mechatech Co., Ltd. | Design / Development and Production of Dies. Production of Lead Frames. | ||||
| LAPIS Semiconductor Co., Ltd. Head office | Headquarters Management Work and Foundry Business Work of Involved in ICs Manufacturing. | ||||
| LAPIS Semiconductor Co., Ltd. Miyazaki Plant | Manufacture of ICs and SiC (Wafer process). | ||||
| LAPIS Semiconductor Co., Ltd. Miyagi Plant | Manufacture of ICs. | ||||
| ROHM Korea Corporation Daejeon Plant | Manufacture of Transistors and Diodes. | ||||
| ROHM Mechatech (Thailand) Co., Ltd. | |
('15.1.9)/'24.1.9/'27.1.8 | JQA/JQA-EM7128 |
|
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| ROHM Mechatech Philippines, Inc. | |
('15.2.12)/’26.3.28/'29.3.27 | TUV/ 44 104 15 93 0014 | Design and Manufacturing of Leadframes and Precision Tooling and Related Parts | |
| ROHM Electronics (Malaysia) Sdn. Bhd. | |
('19.4.7)/'25.3.16/'28.4.6 | BUREAU VERITAS/MY010925 | Manufacture of Diodes and Light Emitting Diodes (LED). | |
| ROHM Semiconductor (China) Co., Ltd. | |
('21.2.3)/'25.5.11/'28.5.10 | TUV/01 104 1533133 | Manufacturing of Diodes, Transistors, Light-Emitting Bodies (LED), Displays, Sensors and Laser Diodes | |
| SiCrystal GmbH | |
('22.5.27)/'25.5.27/'28.5.26 | TUV/15104221970 | Development, Manufacturing and Distribution of Silicon Carbide Substrates. | |
| ROHM Electronics Dalian Co., Ltd. | |
('24.7.9)/'24.7.9/'27.7.8 | CCCI/U006624E0158ROM | Integrated circuits, electronic components and assembly manufacture and relative administration activities | |
| ROHM Integrated Systems (Thailand) Co., Ltd. | |
('24.7.2)/'24.7.2/'27.7.1 | BUREAU VERITAS/TH023214 | Manufacture of Semiconductor Electronics Monolithic Intergrated Circuits (IC-Wafer Testing, Sawed Die), Transistors, Diodes, Resistors (Microchip Resistor), Tantalum Capacitors (Tantalum Pellet & Coated Tantalum Pellet), Optical Module (Hall Element Sensor) and Wireless Modules. | |
| ROHM Electronics Philippines, Inc. | |
('24.8.1)/'24.8.1/'27.7.31 | TUV/01 104 075077 | Manufacture of Monolithic IC's, Transistors, Diodes, Plate Metal Resistors, and Thermal Printhead | |
ISO14001: Environmental management system.
Current as of 11/June/2026
Independent Assurance of Environmental Data
The ROHM Group received an independent assurance of its environmental data by Asuene Veritas Inc. In order to disclose information to society with higher transparency and reliability.
Calculation Methodology of Environmental Data
Reporting Period
Fiscal Year 2025 (April 1, 2025 – March 31, 2026)
Organizational Boundary
ROHM Co., Ltd. and its consolidated subsidiaries (*Excluding sales offices and overseas sales companies whose emissions were determined to be immaterial and to have a negligible impact on the overall calculation.)
GHG Emissions
<Calculation Methodology>
■Scope1
CO₂ emissions from energy consumption: Emissions are calculated by multiplying fuel consumption at each business site by the applicable
CO₂ emission factors.
GHG emissions from PFC gas usage: Emissions are calculated by multiplying GHG emissions at each business site by the Global Warming
Potentials (GWPs) from the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5) and converting them into CO₂-
equivalent (CO₂e) emissions.
■Scope2
Emissions are calculated by multiplying electricity and steam consumption at each business site by the applicable CO₂ emission factors.
For renewable energy usage, including certificates, the CO₂ emission factor is set to zero.
<Emission Factors>
■Scope1
"Calculation Methods and Emission Factors under the Greenhouse Gas Accounting, Reporting and Disclosure System" and "Emission Factors by Gas Utility" published by Japan's Ministry of the Environment (MOE) and Ministry of Economy, Trade and Industry (METI)
■Scope2
【Electricity】
Japan："Emission Factors by Electric Utility" published by MOE and METI
Overseas: Emission factors obtained from local electricity suppliers are used where available. If such factors are unavailable, country-specific grid emission factors from the "IGES List of Grid Emission Factors" published by the Institute for Global Environmental Strategies (IGES) are applied.
【Steam】
Overseas: "FY2019 Energy Consumption Statistics Survey” published by METI, Japan, and “Calculation Methods and Emission Factors under the Greenhouse Gas Accounting, Reporting and Disclosure System” published by MOE and METI, Japan.
Water
<Calculation Methodology>
■Water Withdrawal
Water withdrawal is calculated by aggregating the volumes of water withdrawn at each business site, including municipal water, industrial water, and groundwater.
■Water Discharge
Water discharge is calculated by aggregating the volumes of wastewater discharged from each business site to sewer systems, rivers, and other receiving bodies.
*Estimated calculations are used for certain sites.
■Water Consumption
Water consumption is calculated by aggregating the difference between water withdrawal and water discharge at each business site.
*Due to a revision in the methodology for calculating cooling tower discharge at the Kyoto Headquarters, the Group’s total water discharge decreased, resulting in an approximately 20% increase in water consumption compared with FY2024.
Questionnaire
