BD96801Qxx-C (Under Development)
Configurable PMIC Including 4ch Switching DCDC Regulators and 3ch LDOs

BD96801Qxx-C is an automotive grade configurable PMIC (Power Management Integrated Circuit) with supporting Functional Safety features for application processors, SoCs and FPGAs. It has a scalable approach of output currents and rails by using internal MOSFET delivering up to 8A output or using external Driver MOS with 40A output.

Data Sheet Buy Sample
Data Sheet Buy Sample

Product Detail

 
Part Number | BD96801Qxx-CE2
Package | UQFN48FV6060
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Functional Safety:

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in the datasheet.

Specifications:

ch

7

Vin1(Min.)[V]

2.7

Vin1(Max.)[V]

5.5

Output Voltage1 (Min.)[V]

0.5

Output Voltage1 (Max.)[V]

3.3

Output Current Capacity 1 [A]

2

Output Voltage2 (Min.)[V]

0.5

Output Voltage2 (Max.)[V]

3.3

Output Current Capacity 2 [A]

2

Output Voltage3 (Min.)[V]

0.5

Output Voltage3 (Max.)[V]

3.3

Output Current Capacity 3 [A]

4

Output Voltage4 (Min.)[V]

0.5

Output Voltage4 (Max.)[V]

3.3

Output Current Capacity 4 [A]

4

Output Voltage5 (Min.)[V]

0.3

Output Voltage5 (Max.)[V]

3.3

Output Current Capacity 5 [A]

0.3

Output Voltage6 (Min.)[V]

0.3

Output Voltage6 (Max.)[V]

3.3

Output Current Capacity 6 [A]

0.3

Output Voltage7 (Min.)[V]

0.3

Output Voltage7 (Max.)[V]

3.3

Output Current Capacity 7 [A]

0.3

SW frequency(Max.)[MHz]

2.25

Circuit Current(Typ.)[mA]

8.2

Shutdown Current (Typ.)[uA]

0

Serial I/F

I2C

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Package Size [mm]

6x6 (t=1)

Common Standard

AEC-Q100 (Automotive Grade)

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Features:

  • AEC-Q100 Qualified. (Grade 1)
  • ISO 26262 Process Compliant to Support ASIL-D.
  • Ultra-high Buck Switching Frequency up to 4MHz.
  • Built-in MOSFETs or External Driver MOS.
    (BD96340MFF-C) Selectable for BUCK1 and BUCK2.
  • Built-in MOSFETs for BUCK3 and BUCK4.
  • Dual Phase Operation for BUCK1 and BUCK2.
  • Dual Phase Operation for BUCK3 and BUCK4.
  • Remote Sensing for Accurate Voltage at the Point of Load.
  • Multipurpose LDO for LDO5, 6.
  • Load Switch or LDO Selectable for LDO7 Output.
  • Programmable Power Squencer by OTP (One-time Programmable memory), EEPROM, or I²C.
  • High Precision Built-in Supervision.
    OVD (Over Voltage Detection), UVD (Under Voltage Detection) , TW (Thermal Warning).
  • Built-in Protection.
    OVP (Over Voltage Protection), UVP (Under Voltage Protection), TSD (Thermal Shutdown)
  • Built-in UVLO (Under Voltage Lockout) for VIN, PVIN1 to PVIN7, and VREG15IN.
  • Built-in Digital Self-test for OTP, Power Sequence, and Detection.
  • Built-in Analog Self-test for Detection.
  • Built-in Self-test for Critical Signal Pins (PRSTB, INTB_ADDPRSTB1, EN).
  • Built-in Mutual Monitoring of VREF and OSC.
  • Q&A Watchdog Timer.
  • I²C Support Fast Mode (Max 400kHz) and Fast Mode Plus (Max 1MHz) with CRC.

Reference Design / Application Evaluation Kit

 
    • Reference Design - REF66004
    • Power and Interface solution for X9M/X9E of SemiDrive's Infotainment SoC
    • ROHM has developed an optimal power supply/interface reference design for SemiDrive's next-generation cockpit SoC "X9M/X9E". By providing an optimal power supply and interface reference design for the "X9M/X9E", ROHM is helping to reduce the development burden on designers and achieve the performance required by the market. SemiDrive's latest automotive SoC "X9M/X9E", for which the reference design has been developed, will contribute to the enhancement of various in-vehicle applications, including cockpits.

      Click here for inquiries about SemiDrive's next-generation cockpit SoC "X9M/X9E".


      • Scalable PMIC (BD96801Q12) optimized for use with "X9M/X9E"
      • SerDes IC (BU18xMxx) optimized for automotive camera modules
      • SerDes IC (BU18xL82) supporting full HD (1,980 × 1,080 pixels) for automotive displays with multiple screens
      • Interface IC (BU92RTF82) that contributes to functional safety of in-vehicle displays
      • Automotive 2.7V to 5.5V Input, 12A 1ch, Buck DC-DC Converter IC Integrated FET (BD9SA01F80)

      This reference design consists of three boards. Each is shown below.

      • REF66004-EVK-001 (Core Board)
      • REF66004-EVK-002 (SerDes Board)
      • REF66004-EVK-003 (Display Board)

      Related News:
      ROHM Partners with Nanjing SemiDrive Technology Ltd., China’s SoC Manufacturer of Next-Generation Cockpits, to Develop Automotive Solutions

    • Reference Design - REF66012
    • PMIC solution for ADAS SoC Reference Design
    • The intelligent front camera(IFC) integrates a 2 million pixels high-definition camera and supports access to multiple millimeter wave radars, which can implement L2 level forward ADAS function. This solution uses the Horizon Journey2 chip with 4TOPS AI computing power and the Infineon TRAVEO II series CYT4BF microcontroller. By deploying corresponding visual algorithms on Horizon Journey2 to identify obstacles, lane lines, and other traffic elements, and using the Infineon TRAVEO II series CYT4BF microcontroller for vehicle sensor fusion and vehicle control, this solution can achieve ADAS functions such as AEB, ACC, LCC, and TJA. By selecting Rohm PMIC chips with ASIL D functional safety level, such as BD96801Q09 and BD9S303MUF, the reliability and stability of the intelligent front camera(IFC) can be ensured.


      Collaboration board with Intron Technology

      Intron Technology Holdings Limited, a fast-growing automotive electronics solutions provider in China. We focus on providing solutions targeting critical automotive electronic components applied in new energy, body control, safety and powertrain systems. We utilize our research and development and engineering capabilities to provide solutions incorporating advanced semiconductor devices to help OEMs achieve industry leading performance.

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