R6024ENZ
600V 24A TO-3PF, Low-noise Power MOSFET

R6024ENZ is a power MOSFET with low ON-resistance and fast switching, suitable for the switching application.

Data Sheet Buy * Sample *
* This is a standard-grade product.
For Automotive usage, please contact Sales.
Data Sheet Buy * Sample *
  • Tools  
  • Packaging & Quality  
  • FAQs
  • Contact Us

Product Detail

 
Part Number | R6024ENZC17
Status | Recommended
Package | TO-3PF
Unit Quantity | 300
Minimum Package Quantity | 30
Packing Type | Tube
RoHS | Yes

Specifications:

Grade

Standard

Package Code

TO-3PF

Package Size [mm]

26.5x15.5 (t=5.5)

Applications

Power Supply

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

600

Drain Current ID[A]

24.0

RDS(on)[Ω] VGS=10V(Typ.)

0.15

RDS(on)[Ω] VGS=Drive (Typ.)

0.15

Total gate charge Qg[nC]

70.0

Power Dissipation (PD)[W]

120.0

Drive Voltage[V]

10.0

Trr (Typ.)[ns]

625

Mounting Style

Leaded type

Bare Die Part Number

Available: K7402

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on-resistance
  • Fast switching speed
  • Gate-source voltage (VGSS) guaranteed to be ±20V
  • Drive circuits can be simple
  • Parallel use is easy
  • Pb-free lead plating ; RoHS compliant
SHOW/HIDE COLUMNS
New Product List

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • R6024ENZ SPICE Model
  • R6024ENZ Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations