R6511ENJ
650V 11A TO-263, Low-noise Power MOSFET

R6511ENJ is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

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Product Detail

 
Part Number | R6511ENJTL
Status | Recommended
Package | LPTS (D2PAK)
Unit Quantity | 1000
Minimum Package Quantity | 1000
Packing Type | Taping
RoHS | Yes

Specifications:

Grade

Standard

Package Code

TO-263 (D2PAK)

Package Size [mm]

10.1x13.1 (t=4.7)

JEITA Package

SC-83

Applications

Power Supply

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

650

Drain Current ID[A]

11.0

RDS(on)[Ω] VGS=10V(Typ.)

0.36

RDS(on)[Ω] VGS=Drive (Typ.)

0.36

Total gate charge Qg[nC]

32.0

Power Dissipation (PD)[W]

124.0

Drive Voltage[V]

10.0

Trr (Typ.)[ns]

430

Mounting Style

Surface mount

Bare Die Part Number

Available: K7453

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Features:

  • Low on-resistance
  • Fast switching speed
  • Parallel use is easy
  • Pb-free plating ; RoHS compliant
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Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • R6511ENJ SPICE Model
  • How to Create Symbols for PSpice Models

Characteristics Data

  • R6511ENJ ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations