Models
- R6030ENZ1 SPICE Simulation Evaluation Circuit
- R6030ENZ1 SPICE Model
- R6030ENZ1 Thermal Model (lib)
- How to Create Symbols for PSpice Models
Characteristics Data
- ESD Data
R6030ENZ1
Obsolete
R6030ENZ1
10V Drive Nch MOSFET
Production has already been terminated. Not available for sales.
Product Detail
Replacement Product For R6030ENZ1
| Part Number |
|
|
|---|---|---|
| Ordering Part Number | R6030ENZ1C9 | R6030ENZ4C13 |
| Similar Level | - | Same Pinout, Package |
| Data Sheet | ||
| Supply Status | Obsolete | Recommended |
| Package | TO-247 | TO-247 |
| Unit Quantity | 450 | 600 |
| Minimum Packing Quantity | 450 | 30 |
| Packing Type | Bulk | Tube |
| RoHS | Yes | Yes |
| Package Code | TO-247AD | TO-247AD |
| Package Size [mm] | 15.94x21.07 (t=5.21) | 15.94x20.95 (t=5.22) |
| Grade | Standard | Standard |
| Number of terminal | 3 | 3 |
| Polarity | Nch | Nch |
| Drain-Source Voltage VDSS [V] | 600 | 600 |
| Drain Current ID [A] | 30.0 | 30.0 |
| RDS(on)[O] VGS=10V (Typ.) | 0.115 | 0.115 |
| RDS(on)[O] VGS=Drive (Typ.) | 0.115 | 0.115 |
| Drive Voltage [V] | 10.0 | 10.0 |
| Power Dissipation (PD) [W] | 120.0 | 305.0 |
| Total gate charge Qg [nC] | 85.0 | 85.0 |
| Trr (Typ.)[ns] | - | 660 |
| Mounting Style | Leaded type | Leaded type |
| Applications | Power Supply | Power Supply |
| Bare Die P/N | - | Available: K7407 |
| Storage Temperature (Min.)[°C] | -55 | -55 |
| Storage Temperature (Min.)[°C] | 150 | 150 |
Design Resources
Documents
Reference Design
- R6030ENZ1 Reference Circuit
Technical Articles
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Transistor)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- R6030ENZ1 SPICE Simulation Evaluation Circuit
- R6030ENZ1 SPICE Model
- R6030ENZ1 Thermal Model (lib)
- How to Create Symbols for PSpice Models
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations