Not Recommended for New Designs R6002END
Nch 600V 2A Power MOSFET

This product cannot be used for new designs (Not recommended for design diversion).

Product Detail


Replacement Product For R6002END

Part Number
Ordering Part Number R6002ENDTL R6007END3TL1
Similar Level - Similar Specification
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package CPT3 TO-252
Unit Quantity 2500 2500
Minimum Packing Quantity 2500 2500
Packing Type Taping Taping
RoHS Yes Yes
Package Code TO-252 (DPAK) TO-252 (DPAK)
Package Size [mm] 6.5x9.5 (t=2.3) 6.6x9.9 (t=2.4)
Grade Standard Standard
Number of terminal 3 3
Polarity Nch Nch
Drain-Source Voltage VDSS [V] 600 600
Drain Current ID [A] 1.7 7.0
RDS(on)[O] VGS=10V (Typ.) 2.8 0.57
RDS(on)[O] VGS=Drive (Typ.) 2.8 0.57
Drive Voltage [V] 10.0 10.0
Power Dissipation (PD) [W] 20.0 78.0
Total gate charge Qg [nC] 6.5 20.0
Trr (Typ.)[ns] - 340
Mounting Style Surface mount Surface mount
Applications Power Supply Power Supply
Bare Die P/N Available: K7412 Available: K7410
JEITA Package SC-63 SC-63
Storage Temperature (Min.)[°C] -55 -55
Storage Temperature (Min.)[°C] 150 150

Design Resources


Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple



  • R6002END SPICE Model
  • R6002END Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations