Not Recommended for New Designs R6010MND3
Nch 600V 10A Power MOSFET

This product cannot be used for new designs (Not recommended for design diversion).

Product Detail

 

Replacement Product For R6010MND3

Part Number
R6010MND3
R6010MND3
R6009JND3
R6009JND3
Ordering Part Number R6010MND3TL R6009JND3TL1
Similar Level - Same Pinout, Package
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package TO-252 TO-252
Unit Quantity 2500 2500
Minimum Packing Quantity 2500 2500
Packing Type Taping Taping
RoHS Yes Yes
Package Code TO-252 (DPAK) TO-252 (DPAK)
Package Size [mm] 6.6x9.9 (t=2.4) 6.6x9.9 (t=2.4)
Grade Standard Standard
Number of terminal 3 3
Polarity Nch Nch
Drain-Source Voltage VDSS [V] 600 600
Drain Current ID [A] 10.0 9.0
RDS(on)[O] VGS=10V (Typ.) 0.28 -
RDS(on)[O] VGS=15V (Typ.) - 0.45
RDS(on)[O] VGS=Drive (Typ.) 0.28 0.45
Drive Voltage [V] 10.0 15.0
Power Dissipation (PD) [W] 143.0 125.0
Total gate charge Qg [nC] 20.0 22.0
Trr (Typ.)[ns] - 65
Mounting Style Surface mount Surface mount
Applications Motor, Inverter Motor, Inverter
Bare Die P/N - Available: K7803
JEITA Package SC-63 SC-63
Storage Temperature (Min.)[°C] -55 -55
Storage Temperature (Min.)[°C] 150 150

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations