Models
- R6007MND3 SPICE Model
- R6007MND3 Thermal Model (lib)
- How to Create Symbols for PSpice Models
Characteristics Data
- ESD Data
R6007MND3
Not Recommended for New Designs
R6007MND3
Nch 600V 7A Power MOSFET
This product cannot be used for new designs (Not recommended for design diversion).
Product Detail
Replacement Product For R6007MND3
| Part Number |
|
|
|---|---|---|
| Ordering Part Number | R6007MND3TL | R6007JND3TL1 |
| Similar Level | - | Same Pinout, Package |
| Data Sheet | ||
| Supply Status | Not Recommended for New Designs | Recommended |
| Package | TO-252 | TO-252 |
| Unit Quantity | 2500 | 2500 |
| Minimum Packing Quantity | 2500 | 2500 |
| Packing Type | Taping | Taping |
| RoHS | Yes | Yes |
| Package Code | TO-252 (DPAK) | TO-252 (DPAK) |
| Package Size [mm] | 6.6x9.9 (t=2.4) | 6.6x9.9 (t=2.4) |
| Grade | Standard | Standard |
| Number of terminal | 3 | 3 |
| Polarity | Nch | Nch |
| Drain-Source Voltage VDSS [V] | 600 | 600 |
| Drain Current ID [A] | 7.0 | 7.0 |
| RDS(on)[O] VGS=10V (Typ.) | 0.54 | - |
| RDS(on)[O] VGS=15V (Typ.) | - | 0.6 |
| RDS(on)[O] VGS=Drive (Typ.) | 0.54 | 0.6 |
| Drive Voltage [V] | 10.0 | 15.0 |
| Power Dissipation (PD) [W] | 95.0 | 96.0 |
| Total gate charge Qg [nC] | 10.0 | 17.5 |
| Trr (Typ.)[ns] | - | 60 |
| Mounting Style | Surface mount | Surface mount |
| Applications | Motor, Inverter | Motor, Inverter |
| Bare Die P/N | - | Available: K7809 |
| JEITA Package | SC-63 | SC-63 |
| Storage Temperature (Min.)[°C] | -55 | -55 |
| Storage Temperature (Min.)[°C] | 150 | 150 |
Design Resources
Technical Articles
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Transistor)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- R6007MND3 SPICE Model
- R6007MND3 Thermal Model (lib)
- How to Create Symbols for PSpice Models
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Explanation for Marking
- Condition of Soldering
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations