200V 2A 14ns, PMDE, Ultra Fast Recovery Diode

RFN2VWM2S is a diode with excellent trr, which is important for high frequency operation, and achieves the same electrical characteristics as conventional ROHM products in the small PMDE package. PMDE package is highly reliable and has excellent heat dissipation efficiency.

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* This is a standard-grade product.
For Automotive usage, please contact Sales.

Product Detail

Part Number | RFN2VWM2STR
Status | Recommended
Package | PMDE
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes




Mounting Style

Surface mount

Number of terminal




Reverse Voltage VR[V]


Average Rectified Forward Current IO[A]




Forward Voltage VF(Max.)[V]


IF @ Forward Voltage [A]


Reverse Current IR(Max.)[mA]


VR @ Reverse Current [V]




IF @ trr [mA]


IR @ trr [A]


Storage Temperature (Min.)[°C]


Storage Temperature (Max.)[°C]


Package Size [mm]

1.3x2.5 (t=1)

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  • Low switching loss
  • Low forward voltage
  • High current overload capacity

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Different Grade

RFN2VWM2STF   Grade| Automotive StatusRecommended

Supporting Information



ROHM’s proprietary compact PMDE package features a land pattern equivalent to that of the conventional SOD-323 type. Reviewing the backside electrode and heat dissipation path allowed ROHM to achieve the same electrical characteristics (i.e. current, withstand voltage) as the standard SOD-123FL package (3.5mm × 1.6mm) in a smaller package size, contributing to board miniaturization by reducing mounting area by approximately 42%. Furthermore, mechanical strength is around 1.4 times higher than that of the SOD-123FL, reducing the risk of solder cracking when stress is applied to the board, ensuring greater mounting reliability.

Key Features of the PMDE Package

1. Significantly improved heat dissipation achieves 42% smaller mounting area

Generally, semiconductor components dissipate heat generated into the air or through the substrate. However, when decreasing package size the surface area of the back of the electrode and mold also becomes smaller, resulting in lower heat dissipation.
The PMDE package, to solve this problem, increases the back electrode area to facilitate the heat dissipation path from the lead frame to the substrate. The result is significantly improved heat dissipation performance, achieving the same electrical characteristics as the standard SOD-123FL package (3.5mm × 1.6mm) with in a smaller 2.5mm × 1.3mm size. This translates to a 42% smaller mounting area, making it ideal for automotive applications where higher component density is needed.

Comparison of Heat Dissipation Path: SOD-123FL vs PMDE

2. Ensures higher reliability compared to conventional packages

The PMDE package achieves a mounting strength of 34.8N, approximately 1.4 times higher than that of the SOD-123FL package, by increasing the area of the metal portion that ensures a larger backside electrode area. This reduces the risk of solder cracking when stress is applied to the board, contributing to greater reliability. High surge current withstand capability (IFSM) is also achieved by adopting a wire-free structure whereby the chip is directly sandwiched between frames. The resulting high surge current withstand capability (IFSM) provides superior resistance to destruction caused by high instantaneous currents, such as during vehicle start or abnormal device operation.

Novel Wire-Free Design

FRDs: RFN Series Features

FRDs provide high withstand voltage (up to 800V) equivalent to rectifier diodes along with excellent trr (reverse recovery time), which is important for high frequency operation.
The RFN series offers the same electrical characteristics as conventional products in a compact PMDE package.

Application Examples

  • ・Engine ECUs
  • ・Transmission ECUs
  • ・TVs
  • ・ADAS
  • ・Air Conditioners
  • ・Car Infotainment

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