1ch Small Package High Side Switch ICs for USB Devices and Memory Cards

This is the product guarantees long time support in Industrial market. The High-side switch for memory card slot is an IC High-side switch with a function of over-current protection used in the power supply line of a memory card slot. In the switch part an N channel MOSFET low ON resistance has been 1 circuit integrated. Moreover, a soft start function, an under voltage lockout function and an over temperature protection function are integrated.

Product Detail

Part Number | BD2227G-LBTR
Status | Active
Package | SSOP5
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes


Supply Voltage(Min.)[V]


Supply Voltage(Max.)[V]


Current consumption(Typ.)[µA]


ON Resistance [mΩ]


Channel Number [ch]


Control Input Logic

Active Low

Over Current Detect [A]

0.75 to 1.35

Output Turn on Time [ms]


Thermal Shut Down


Flag Output Delay at Over Current [ms]


Operating Temperature (Min.)[°C]


Operating Temperature (Max.)[°C]


Package Size [mm]

2.9x2.8 (t=1.25)


· Long time support a product for Industrial applications.
· Single low on-resistance (Typ.=150mO) Nch MOSFET
· Continuous load current
    0.2A (BD2202G), 0.5A (BD2206G), 0.5A (BD6538G)
    0.55A (BD2224G, BD2225G)
    0.75A (BD2226G, BD2227G)
· Soft start function
· Over current protection circuit
· Over temperature protection circuit
· Under voltage lockout
· Power supply voltage range
    BD2202G, BD2206G : 2.7V to 3.6V
    BD6538G, BD2224G, BD2225G, BD2226G, BD2227G : 2.7V to 5.5V
· Operating temperature range
    BD2202G, BD2206G : -25? to 85?
    BD6538G, BD2224G, BD2225G, BD2226G, BD2227G : -40? to 85?
· SSOP5 Package

Design Resources


Technical Articles

Schematic Design & Verification

  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance



  • SSOP5 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)