BD16950EFV-C
2ch Half-Bridge Gate Driver

The BD16950EFV is an AEC-Q100 automotive qualified 2-channel Half-Bridge Gate Driver, controlled by an external MCU through a 16-bit Serial Peripheral Interface (SPI). Independent control of low-side and high-side N-MOSFETS allows for several MCU controlled modes. A programmable drive current is available to adjust slew-rates, in order to meet EMI and power dissipation requirements. Diagnostics can be read and reset by an external MCU.

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Product Detail

 
Part Number | BD16950EFV-CE2
Status | Recommended
Package | HTSSOP-B24
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes
Functional Safety | FS supportive

Specifications:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Vcc (Max.)[V]

40.0

Power Supply Voltage (Max.)[V]

40.0

Power Supply Voltage (Min.)[V]

5.5

Output On Resistance (Typ.)[Ω]

10.0

Number of Motors

1.0

VREF・PWM

-

Current Limit

-

High Speed Drive

-

Automotive class

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Features:

  • AEC-Q100 Qualified
  • 2ch Half-Bridge Gate Drivers
  • 4 external MOSFETs are Controlled Independently
  • Half-Bridge Control Modes are Selected by SPI
  • Slew Rates are Controlled with Constant Source/Sink Current.
  • 500 kHz Oscillation for Charge Pump.
  • 16bit SPI

Evaluation
Board

 
    • Evaluation Board
    • BD16950EFV-EVK-001

    • This Evaluation Board consists of the Automotive 2-channel Half-Bridge Driver IC and USB cable. Also a GUI can be provided for easy SPI register configuration. Besides this motor driver IC the evaluation board contains all external components necessary for operation including a full bridge created by discrete FETs, an LDO for logic supply, SPI interface and various test points for signal monitoring.

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Design Resources

 

Documents

User's Guide

  • Evaluation Board User's Guide for BD16950EFV-C

Application Note

  • 2 Channel Half-Bridge Gate Driver Setup Guide

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • HTSSOP-B24 Footprint / Symbol
  • HTSSOP-B24 3D STEP Data

Packaging & Quality

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration