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Although the materials and internal structure differ, the specifications (i.e. external dimensions, electrical characteristics) remain the same. In contrast to the UDZS series, which features Sn-3Ag-0.5Cu plating, utilizes halogen resin and a wireless bonding method, the newer UDZV series employs 100% Sn plating, utilizes halogen-free resin, and wire bonding processes.