Overview

ROHM’s silicon capacitors manufactured using proprietary RASMID™ miniaturization technology allow processing in 1µm increments that eliminates chipping during external formation and improves dimensional tolerances within ±10µm. This small variation in product size enables mounting with a narrower distance between adjacent components. At the same time, the backside electrode used for bonding to the substrate has been expanded to the periphery of the package to improve mounting strength.

The first series in the lineup, the BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) consists of the industry’s smallest 01005-size (0.1inch × 0.05inch) / 0402-size (0.4mm × 0.2mm) mass-produced surface mount silicon capacitors. The mounting area is reduced by approximately 55% over general 0201-size (0.2inch × 0.1inch) / 0603-size (0.6mm × 0.3mm) products to just 0.08mm², contributing to greater application miniaturization. Moreover, a built-in TVS protection element ensures high ESD resistance that minimizes the number of person-hours required for surge countermeasures and other circuit design elements.

Application Examples

Smartphones, wearables, compact IoT devices, optical transceivers, etc.