BTD1RVFL102 (New)
RASMID™ Series, 3.6V, 1000pF, DSN0402-2 (SOD-992), Silicon (Si) Capacitor

BTD1RVFL102 is 0402 (01005) size Silicon Capacitor, ideal for Wearable equipment, Wireless, ROSA/TOSA.

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Product Detail

Part Number | BTD1RVFLT27N102
Status | Recommended
Package | SMC0402
Unit Quantity | 27000
Minimum Package Quantity | 27000
Packing Type | Taping
RoHS | Yes


Capacitance value [pF]


Rated Voltage [V]


Size [mm](inch)

0402 (01005)

Height [μm]


Mounting by

Surface mount

Operating Temperature (Min.)[°C]


Operating Temperature (Max.)[°C]


Package Size [mm]

0.2x0.4 (t=0.199)

Find Similar


  • High reliability
  • Low profile (180μm)
  • ESD protection level ±8kV(HBM)
  • Dimension tolerance ±10μm
  • High shear strength by large electrode size

Supporting Information



ROHM’s silicon capacitors manufactured using proprietary RASMID™ miniaturization technology allow processing in 1µm increments that eliminates chipping during external formation and improves dimensional tolerances within ±10µm. This small variation in product size enables mounting with a narrower distance between adjacent components. At the same time, the backside electrode used for bonding to the substrate has been expanded to the periphery of the package to improve mounting strength.

The first series in the lineup, the BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) consists of the industry’s smallest 01005-size (0.1inch × 0.05inch) / 0402-size (0.4mm × 0.2mm) mass-produced surface mount silicon capacitors. The mounting area is reduced by approximately 55% over general 0201-size (0.2inch × 0.1inch) / 0603-size (0.6mm × 0.3mm) products to just 0.08mm2, contributing to greater application miniaturization. Moreover, a built-in TVS protection element ensures high ESD resistance that minimizes the number of person-hours required for surge countermeasures and other circuit design elements.

Comparison of Silicon Capacitor
Package Size and Mounting Strength
Mounting Area Comparison in Communication Circuit

Application Examples

Smartphones, wearables, compact IoT devices, optical transceivers, etc.


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