BD3490FV
Sound Processors with Built-in 2-Band Equalizer

ROHM's sound processors deliver high-fidelity audio, are easy to use, integrate a two-band equalizer, and are compatible with power supply voltages between 4.75V and 9.5V due to low current consumption operation, making them ideally suited for use in portable stereo systems.

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Product Detail

 
Part Number | BD3490FV-E2
Status | Recommended
Package | SSOP-B28
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Specifications:

Vcc(Min.)[V]

4.75

Vcc(Max.)[V]

9.5

Iq[mA]

7.0

I/F

I2C BUS

Volume Range

0to-87 / -∞ (1dB / step) Independent control

Tone Control Band

BASS, Treble

Input Gain[dB]

0 / 2 / 4 / 6 / 8 / 12 / 16 / 20

Surround

Yes

THD[%]

0.002

Output Noise[µVrms]

5

Output voltage(Max.)[Vrms]

2.3

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Package Size [mm]

10x7.6 (t=1.35)

Features:

・Low noise (5μVrms(TYP.)) and low distortion(0.002% (TYP.)).
・Built-in simple surround. Furthermore, it can constitute good surround of sound image
    normal position with an external part.
・It can constitute a bass boost or output gain with an external part.
・When the volume setting exchanging, it can use a volume terminal as a microphone input
    terminal
    because there is not an impedance change of a volume terminal.
・Bi-CMOS process is suitable for the design of low current and low energy. And it provides
    more quality for small scale regulator and heat in a set.
・The package of this IC is SSOP-B28. It gathers a sound input terminals, sound output
    terminals respectively and it arranges them, to be arranging facilitates the
    laying-out of PCB pattern and reduces PCB area to one-way in the flow of the
    signal.

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SSOP-B28 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)