BD34602FS-M
MUS-IC™ Series, 6ch Sound Processor for High-Quality Audio with Built-in Advanced Switch

BD34602FS-M is a 6ch independent volume system. It is designed to have high-quality sound by improving the op-amp and optimizing the design layout. In addition, it is compatible, same package and it has common control with BD3461FS, therefore replacement from BD3461FS is easy.

It is the masterpiece of ROHM audio IC which pursues both the numerical values and sound quality performance required in an audio device to the utmost limits and created through the ardency of ROHM engineeers. That is ROHM Musical Device "MUS-IC".

"MUS-IC" Web Page

Product Detail

 
Part Number | BD34602FS-ME2
Status | Recommended
Package | SSOP-A24
Unit Quantity | 2000
Minimum Package Quantity | 2000
Packing Type | Taping
RoHS | Yes

Functional Safety:

Category : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.

Specifications:

Common Standard

AEC-Q100 (Automotive Grade)

Vcc(Min.)[V]

7.0

Vcc(Max.)[V]

9.5

Iq[mA]

35.0

I/F

I2C BUS

Outputs

6

FADER[dB]

+23to-79 (1dB / step), -∞

THD[%]

4.0E-4

Output Noise[µVrms]

1.3

Output voltage(Max.)[Vrms]

2.35

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Package Size [mm]

10x7.8 (t=2.1)

Features:

  • AEC-Q100 Qualified
  • Advanced switch circuit can reduce the switching pop noise during volume attenuation
  • Built-in 6ch independent volume circuit available with changing by 1dB/Step
  • Built-in DIFF amplifier inputs, ideal for external input
  • Built-in volume circuit for mixing external signal available with changing by 1dB/Step
  • Package is SSOP-A24. Putting input-terminals together and output-terminals together can make PCB layout easier and can makes area of PCB smaller.
  • It is possible to control by 3.3V for I²C-BUS Controller

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • SSOP-A24 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)