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Please refer to the ‘Soldering Conditions’ section on our website for details. Generally, Pb-free solder paste (Sn-3Ag-0.5Cu) should be used. Flow and manual soldering is not recommended for ultra-compact chip resistors (0201 size) or chip networks (0402×2, 0402×4, 0603×2, 0603×8) due to possible solder bridging. However, if such methods will be used, ROHM recommends thorough testing under actual conditions before mass production.