common_css

coretechnologies_title

CORE TECHNOLOGIES

coretechnologies_main

  • Power Electronics
  • Sensor Technology
  • AI

Power Electronics

Technology that contributes to guaranteeing stable operation of instrumentsComparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives

Research areas

  • ・Semiconductor packaging
  • ・Design for reliability
Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives

Presented papers

Introductory Video

Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives


The technology that contributes to cost reduction of power amplifiersDeep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si

Research areas

  • ・Power Electronics
Deep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si

Presented papers

Introductory Video

Deep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si


Technology that contributes to energy saving by improvement of performanceA Method for Measuring the Characteristics of Power Transistors in the Real Operating Range

Research areas

  • ・Power transistor
  • ・Device characterization
  • ・Device modeling
A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range

Presented papers

Introductory Video

A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range


Technology that contributes to noise suppression in the development of power electronics circuits Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure

Research areas

  • ・Electromagnetic simulation
  • ・Power Modules
Calculated near field intensity distribution (dBuV)

Presented papers

Introductory Video

Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure


Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works

Research areas

  • ・Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
  • ・Electro-thermal Co-simulation
Power System Simulation

Device Modeling and Power Module Modeling

Device Modeling and Power Module Modeling

Electro-thermal Co-simulation

Electro-thermal Co-simulation

Presented papers


“Ultra Small* , Cool Well”Transfer Molded SiC Power Module

*August, 2018 ROHM survey

Features

  • ・The industry’s lowest*1 thermal resistance*2
  • ・Ultra-compact, lightweight
  • ・High power density : 15kW/cm3
  • *1:August, 2018 ROHM survey
  • *2:With the same chip size, board size, and cooling capacity

Applications

  • ・Automotive high-power DC/DC converters
  • ・Main drive inverters in vehicles

Appearance

Appearance

Thermal Resistance (Rthj-w)

Thermal Resistance (Rthj-w)

Max. Junction Temperature Comparison

Max. Junction Temperature Comparison

SiC Modules Contribute to Wireless Power Supply for In-Wheel Motors While DrivingEnabling Direct Wireless Charging While Driving Significantly Extends EV Travel Range (to Nearly Infinity in Theory)

SiC Modules

Joint development with the Fujimoto Laboratory at Tokyo University and several other companies


SiC Application Demonstration3-Phase 50kW Bidirectional Inverter Utilizing SiC Devices

Power Assist Technology

Features

  • ・Demonstration of a 3-phase bidirectional inverter that delivers over 99% (Max) efficiency
  • ・Achieves 50kW output utilizing discrete devices
  • ・Achieves 1.8x the output power of the previous 30kW inverter demo

Applications

  • ・Grid-connected energy storage systems
  • ・Uninterruptible power systems
  • ・Power circulating load equipment

Overview

Overview

SiC Devices

SiC Devices

Circuit Configuration

Circuit Configuration

Characteristics

Characteristics

Performance

Performance

2MHz/120W DC/DC Converter Using GaN-FET2MHz/120W DC/DC Converter

Features

  • ・Small size
  • ・Large power density

Applications

  • ・Base station power systems
  • ・Server power systems

Circuit Configuration

Circuit Configuration

Specification

Specification

Power Conversion Efficiency Comparison

Power Conversion Efficiency Comparison

Power Density

Power Density

Reliability Design For Electronic PackagesDeformation Behavior Analysis of Electronic Materials and Packages

Research areas

  • ・Mate rials : Sintered silver, Solder, Resin
  • ・Materials characterization : Film Tensile test, Stress-Strain curve, Thermal deformation, Finite Element Method

Research Example1 : Mechanical Behaviors of Sintered Porous Silver films

Research Example1 : Mechanical Behaviors of Sintered Porous Silver films

Research Example2 : For Designing Reliable Packages

Research Example2 : For Designing Reliable Packages

Presented papers

Sensor Technology

Compact, Lightweight, Room-temperature, Antenna-Integrated Terahertz Oscillators and DetectorsTerahertz Resonant Tunneling Diodes

Features

  • ・Compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (RTD)
  • ・High speed switching
    (Operable for over 25Gbps direct modulation and detection)
RTD Oscillators / Detectors

Applications

  • ・Non- destructive inspection (i.e. internal materials, moisture, metals)
  • ・Security systems
  • ・Medical, Bio Sensor
  • ・Ultra-high-speed wireless communication
Applications

Size comparison with an existence THz source

Size comparison with an existence THz source

Broadband operation and sensitive detection

Broadband operation and sensitive detection

Selectable Permeability Enables Internal Inspection

Selectable Permeability Enables Internal Inspection

Ultra-High Speed Wireless Communication

Ultra-High Speed Wireless Communication

Non-SLAM “Autonomous Mobile Robot Technology without MAP”NoMaDbot™ –No Map Driving Robot-

Features

  • ・AMR (Autonomous Mobile Robot)
  • ・Reaches its destination even in a changing layout
  • ・Simple low-cost structure
  • ・Available immediately after purchase: Requires no extra time, expertise, or technology for implementation
  • ・Equipped with echolocation technology: Achieves spatial recognition through ultrasonic waves

NoMaDbot™ –No Map Driving Robot-

Design Concepts

  • ・Travel straight to the destination while avoiding obstacles along the way
  • ・Cheap, easy, trouble-free

Markets

  • ・SMEs (Small- to Medium-sized Enterprises) unable to take the risk of cost and time for implementation
  • ・Factories that do not require advanced system integration
  • ・Construction sites with frequent layout changes
  • ・Environments with mirrored equipment, glass walls, and/or special lighting not ideal for LiDAR or cameras

Terminology

-SLAM(Simultaneous Localization and Mapping)
A technology for building a map while keeping track of location at the same time

-Echolocation
A technique used by animals to determine the distance, direction, and size of objects by emitting sounds or ultrasonic waves and detecting their reverberation.

Introductory Video


Cost-effecti©ve way to develop next-generation quantum devicesObservation of luminescence of the Si-vacancy defects created in a bulk SiC substrate

Research areas

  • ・Magnetic sensing
  • ・Temperature sensing
  • ・Single-photon sources
Observation of luminescence of the Si-vacancy defects created in a bulk SiC substrate

Presented papers

Prominent luminescence of silicon-vacancy defects created in bulk silicon carbide p–n junction diodes


The technology satisfying the competing operation of ultra-short pulse and high powerLD Module for LiDAR

Features

  • ・Ultra-short pulse (<5ns) operation compatible with high laser power (100W to 200W)
  • ・Surface mounting resin-mold package
  • ・LD, FET, and capacitors integrated in a compact package

Applications

  • ・Autonomous driving
  • ・Range finding
  • ・Industrial robots

Low-inductance design is the key for ultra short pulse high-power laser

Low-inductance design is the key for ultra short pulse high-power laser

Development Roadmap

Development Roadmap

Typical characteristics of the LD module

Typical characteristics of the LD module

Circuit Diagram and Appearance

Circuit Diagram and Appearance

Thermal conductivity hydrogen microsensor

Features

  • ・Thermal conductivity sensor features long-term stability
  • ・Improved accuracy in detecting hydrogen
  • ・Low power consumption owning to MEMS technology

Applications

  • ・Measurement of hydrogen content for a range of 0~100%
  • ・Accurate detection of hydrogen leakage
  • ・Measurement of contents other than hydrogen is also possible
Comparison of hydrogen sensors
Error relative to full scale due to interference gas

MEMS Actuators and TransducersMEMS Devices Utilizing Thin-Film Piezo Technology

Research areas

  • ・Conducted studies on high efficiency piezoelectric thin films
  • ・Carried out R&D on electronic devices utilizing thin-film piezo technology
  • ・Analyzed the operation and failure modes of piezo devices and implemented research into high reliability prediction technology based on the Finite Element Method (FEM)
Piezoelectric Acoustic Sensor Loud Speaker and

Piezoelectric Thin-Film Reliability Technology

Piezoelectric Thin-Film Reliability Technology

AI​​

Automatic detection methodAgeing Monitoring of GaN Transistors using Recurrent Neural Networks

Research areas

  • ・Reliability
  • ・Machine learning
Ageing Monitoring of GaN Transistors using Recurrent Neural Networks

Introductory Video

Ageing Monitoring of GaN Transistors using Recurrent Neural Networks

New_company localNavi.js

New_company common.js

newcompany_tab_js