Depending on the storage environment, there should be no performance degradation caused by moisture absorbed by the packaging materials (MSL=1). However, solderability during mounting may be adversely affected due to terminal oxidation from long-term storage. In this case, we recommend that sufficient connection be ensured between the terminals and substrate, such as by lengthening the solder time. The recommended storage conditions are: 5-40°C, 30-80%RH, and 5 years for electroplated products. But solderability may be affected after 1 year for molten solder.