BD16912EFV-C
40V/3A Rating H-Bridge Driver for Automotive

BD16912EFV-C is a 1-ch H-bridge DMOS FET driver for automotive application. High efficiency driving is possible by direct PWM control or constant current PWM control. It is equipped with Output Current Detection Amplifier, Abnormality Detection Signal Output, low ON resistance and small package, contributing to high reliability, low power consumption and space saving of the set.

Product Detail

 
Part Number | BD16912EFV-CE2
Status | Recommended
Package | HTSSOP-B20
Unit Quantity | 2500
Minimum Package Quantity | 2500
Packing Type | Taping
RoHS | Yes
Functional Safety | FS supportive

Specifications:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Vcc (Max.)[V]

40.0

Power Supply Voltage (Max.)[V]

18.0

Power Supply Voltage (Min.)[V]

6.0

Iout (Max.)[A]

3.0

Output On Resistance (Typ.)[Ω]

0.36

Number of Motors

1.0

VREF・PWM

Yes

Current Limit

Yes

High Speed Drive

-

Automotive class

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Features:

  • AEC-Q100 Qualified (Grade 1)
  • Small Package with Backside Exposed PAD
  • Driver with Built-in Power DMOS FET
  • 2 Input Control (Forward Rotation, Reverse Rotation,Idle Rotation, Brake)
  • Direct PWM Control
  • Constant Current PWM Control (Current limit)
  • Power Save (Standby)
  • Through Current Prevention
  • Output Current Detection Amplifier
  • Abnormality Detection Signal Output
  • Abnormality Detection (Over Current, Over Voltage, Thermal Shutdown: TSD, Thermal Warning: TW)
  • Output Protection (Over Current, Over Voltage, Thermal Shutdown: TSD)
  • Under Voltage Lock Out: UVLO

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • HTSSOP-B20 Footprint / Symbol
  • HTSSOP-B20 3D STEP Data

Packaging & Quality

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration